Intel Socket 775, 1366, 1155 and 1156:
CPU： 所有奔騰 D/ 奔騰 4/ 所有賽揚 D/ 所有奔騰雙核/ 至尊/ 全酷睿 2 至尊/酷睿 2 四核/ 酷睿 2 雙核， 酷睿 i5， 酷睿 i7
AMD Socket AM2/ AM2+/ AM3/ AM3+/ FM1/ FM2:
CPU： 所有速龍 64 x2， 速龍 64， 全速龍 II， 全閃龍， 飛鴻， 飛鴻 II， 全 A 系列 AMD APU 拉諾
Traditional heat pipe arrangement of high-end heatsink heatpipes are usually soldered on one row. Therefore the heat absorption capacity of the outer heatpipe will be negatively affected when there are more than 5 heatpipes.
To solve this problem a special array of heatpipes was used on GX-7 to take full advantage of all 7 6mm heatpipe heat transfer capacity. On GX-7 two heatpipes were soldered on top of three middle heatpipes.
Traditional heatpipe arrangement
Unique heatpipe arrangement on GX-7 to take full advantage of all 7 heatpipe
Air Flow Concept:
The fins in the middle part of the heatsink of GX-7 were designed in a V-shape. This allows the cooling air to reach the heatsink module more evenly. Thanks to some openings inside of the heatsink and near the heatpipes let fresh-air flows in from the top and the bottom to zones normally poorly ventilated and eliminates the creation of hotspots from building. The unique heatsink shape supports dual fans.
Besides the multi-award winning high performance GC-2 thermal compound ddditionally mounting clips for AMD AM2/ AM2+/AM3/AM3+/FM1 and Intel 775, 1366, 1155, 1156 sockets and back plates for Intel LGA 775, Core i5 and Core i7 boards are all included.
MSRP: USD 70 / Euro 45