Gelid Solutions – GP-EXTREME 120×20 THERMAL PAD


  • Beste Wärmeleitpads für Laptops, GPUs und Spielkonsolen.
  • Ultimative Wärmeleitfähigkeit
  • Nicht-elektrisch leitfähig
  • Nicht korrosiv, nicht aushärtend und ungiftig



Value Pack 0.5mm
Value Pack 1.0mm
Value Pack 1.5mm
Value Pack 2.0mm
Value Pack 2.5mm
Value Pack 3.0mm

GP-Extreme 120×20 Wärmeleitpads Serie


Das hochmoderne Thermal Pad


Einzelpackung (1 Stk. enthalten): 0,5 mm (TP-GP05-A), 1,0mm (TP-GP05-B), 1,5mm (TP-GP05-C), 2,0mm (TP-GP05-D), 2,5mm (TP-GP05-F), 3,0mm (TP-GP05-E)
Value Pack (2 Stück enthalten): 0,5mm (TP-VP05-A), 1,0mm (TP-VP05-B), 1,5mm (TP-VP05-C), 2,0mm (TP-VP05-D), 2,5mm (TP-VP05-F), 3,0mm (TP-VP05-E)


Gelid Solutions GP-Extreme 120×20 wurde entwickelt, um den thermischen Kontakt zum Kühlkörper zu perfektionieren, wenn er auf Leiterplatten mit Höhenunterschieden und unebenen Oberflächen installiert wird, wie z. B. bei Mikrocontroller-Einheiten, Speicher-ICs und analogen ICs, MOSFETs, und andere SMD-Bauteile. Dank seiner Weichheit und ultimativen Wärmeleitfähigkeit füllt das GP-Extreme die Räume richtig aus und bietet die beste Leistung in seiner Klasse. GP-Extreme ist nicht elektrisch leitfähig und nicht korrosiv, nicht aushärten, und ungiftig. Das GP-Extreme gewährleistet eine einfache Anwendung und die Abmessungen des Wärmeleitpads von 120×20 mm passen optimal zu großen Leiterplattenflächen von VGA-Karten und Laptops, Spielkonsolen, und andere dicht gepackte Geräte.


GP-Extrem 120x120


Hinweis: Bitte entfernen Sie die Schutzfolien vor der Anwendung!


EAN (Einzelpackung 1 Stk.):
0,5 mm: 4897025783993
1mm: 4897025783986
1,5 mm: 4897025782006
2mm: 4897025783294
2,5 mm: 4897025783430
3mm: 4897025783300


EAN (Wertpaket 2 Stück):
0,5 mm: 4897025783317
1,0 mm: 4897025783324
1,5 mm: 4897025783331
2,0 mm: 4897025783348
2,5 mm: 4897025783447
3,0 mm: 4897025783355


Density (g/cm3): 2.8
Hardness (Shore): 35 00
Size (mm): 120 x 20
  • What are Thermal Pads?

Thermal Pad, or Thermally Conductive Pad, is a pre-formed sheet of solid material made of a wax, silicone or synthetic matrix that is filled with a composition of thermally conductive microparticles and engineered to conduct heat efficiently from a high-temperature surface to heatsink installed onto it. Once placed pad in between, it softens, fills the surface gaps and boosts heat transfer.

  • Where are Thermal Pads used?

General applications: Motherboard VRM, Motherboard Chipset, SSD, DRAM ICs, GPU VRAM, GPU VRM, micro-controller units, MOSFETs and analog ICs.


  • Which thickness variant of GP-Extreme / GP-Ultimate will fit my application?

It may vary significantly depending on the device that is supposed to be used with. Please refer to the device manual / instructions or reach out to us for more information.


  • Can Thermal Pads be reused?

Unfortunately not, you cannot reuse thermal pads.


  • Are Thermal Pads adhesive?

No, thermal pads are not adhesive. You will need a proper mounting to hold the thermal pad with a heatsink.

  • Can I stack Thermal Pads?

When using thermal pads, it’s not recommended that you stack one above the other. Doing so will create gaps between the pads and degrade heat transfer.

  • Are GP-Extreme / GP-Ultimate compressible?

Yes, you can compress GP-Extreme / GP-Ultimate by up to 30% of thickness with an adequate pressure of the heatsink mounts.


  • How long does GP-Extreme / GP-Ultimate last?

GP-Extreme / GP-Ultimate carries a 5 year limited warranty.


  • Are Thermal Pads electrically conductive?

Absolutely not! Thermal pads are non-electrically conductive.


  • Can I use GP-Extreme / GP-Ultimate with a CPU heatsink?

Yes, you can. Although it’s advisable that you use GC-Extreme Thermal Paste for best performance in CPU applications.

  • Where can I find the W/mK specifications of GP-Extreme / GP-Ultimate?

We don’t use the W/mK rating since it may vary depending on your application and doesn’t reflect real-world performance. Please consider the thinnest possible GP-Extreme / GP-Ultimate variant in your application for efficient heat transfer and best performance.