GELID Solutions Ltd. designs and manufactures CPU and VGA coolers, chassis fans, thermal compounds, accessories and other equipment for computers and electronic devices. The company also supplies a range of products for international OEM and ODM clients.
GELID Solutions Ltd. is based in Hong Kong, Asia’s world city, and has multiple manufacturing facilities in Mainland China and Taiwan.
NEWSLETTER & GET DISCOUNT 10% OFF
Sign up to our newsletter for a 10% discount
Gelid GP-Ultimate 90 x 50 Thermal Pad with Motherboard VRM HeatsinkVanessa TassaraOctober 28, 2019
Gelid GP-Ultimate 90 x 50 Thermal Pad with Motherboard VRM Heatsink
Single Pack (1pc included): 0.5 mm (TP-GP04-A), 1.0mm (TP-GP04-B), 1.5mm (TP-GP04-C), 2mm (TP-GP04-D), 3mm (TP-GP04-E)
Value Pack (2pcs included): 0.5 mm (TP-VP04-A), 1.0mm (TP-VP04-B), 1.5mm (TP-VP04-C), 2mm (TP-VP04-D), 3mm (TP-VP04-E)
Gelid Ultimate is designed to provide perfect thermal contact to heatsinks when installed on PCB with height differences and uneven surfaces such as power MOSFETs, chipsets, analog ICs, micro-controller units and other high-temperature SMD components. Thanks to its enhanced multilayer matrix, superior material composition and the ultimate thermal conductivity, the GP-Ultimate fills spaces properly and offers the best performance in class.
The Gelid Ultimate is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60°C to 220°C. It features easy application, and has the thermal pad dimensions of 90x50mm to best fit for large PCB surfaces of GPU cards, motherboards, add-on cards and any other densely packed electronic device.
Note: Please remove the protective films from both sides before application!
Thermal Pad, or Thermally Conductive Pad, is a pre-formed sheet of solid material made of a wax, silicone or synthetic matrix that is filled with a composition of thermally conductive microparticles and engineered to conduct heat efficiently from a high-temperature surface to heatsink installed onto it. Once placed pad in between, it softens, fills the surface gaps and boosts heat transfer.
Where are Thermal Pads used?
General applications: Motherboard VRM, Motherboard Chipset, SSD, DRAM ICs, GPU VRAM, GPU VRM, micro-controller units, MOSFETs and analog ICs.
Which thickness variant of GP-Extreme / GP-Ultimate will fit my application?
It may vary significantly depending on the device that is supposed to be used with. Please refer to the device manual / instructions or reach out to us for more information.
Can Thermal Pads be reused?
Unfortunately not, you cannot reuse thermal pads.
Are Thermal Pads adhesive?
No, thermal pads are not adhesive. You will need a proper mounting to hold the thermal pad with a heatsink.
Can I stack Thermal Pads?
When using thermal pads, it’s not recommended that you stack one above the other. Doing so will create gaps between the pads and degrade heat transfer.
Are GP-Extreme / GP-Ultimate compressible?
Yes, you can compress GP-Extreme / GP-Ultimate by up to 30% of thickness with an adequate pressure of the heatsink mounts.
How long does GP-Extreme / GP-Ultimate last?
GP-Extreme / GP-Ultimate carries a 5 year limited warranty.
Are Thermal Pads electrically conductive?
Absolutely not! Thermal pads are non-electrically conductive.
Can I use GP-Extreme / GP-Ultimate with a CPU heatsink?
Yes, you can. Although it’s advisable that you use GC-Extreme Thermal Paste for best performance in CPU applications.
Where can I find the W/mK specifications of GP-Extreme / GP-Ultimate?
We don’t use the W/mK rating since it may vary depending on your application and doesn’t reflect real-world performance. Please consider the thinnest possible GP-Extreme / GP-Ultimate variant in your application for efficient heat transfer and best performance.