•         Best-in-Class Heat Conductivity
  •         Non-Electrical Conductive Compound
  •         Non-Corrosive, Non-Curing & Non-Toxic
  •         No Bleeding & User Friendly
  •         GELID Applicator
  •         Net Content 5g & 1g

GC-Pro Thermal Compound series: (TC-GC-PRO-A) for 5g & (TC-GC-PRO-D) for 1g


The GC-Pro is made from the purest thermal conducting materials and offers outstanding thermal properties. Thanks to nano scale produced ultra-fine molecular structure the GC-Pro fills spaces more effectively than conventional materials and therefore it provides uniform thermal contact with enhanced heat transfer properties. Created for professionals the GC-Pro thermal compound ensures the best-in-class performance for your CPU, VGA or Chipset heatsink applications. As with the other compounds of GELID Solutions the GC-Pro is non-electrical conductive, non-corrosive, non-curing, non-flammable and non-toxic. The GC-Pro also comes with a GELID applicator which enables an easier application.


Density (g/cm3): 2.8
Net Content: 5g & 1g
Thermal conductivity (W/mK): 7
Viscosity (Centipoise): 170000