GELID Solutions Ltd

Unit 704 B, Sunbeam Centre

27 Shing Yip Street, Kwun Tong, Hong Kong

 

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GC-PRO

Features:

  •         ● Best-in-Class Heat Conductivity
  •         ● Non-Electrical Conductive Compound
  •         ● Non-Corrosive, Non-Curing & Non-Toxic
  •         ● No Bleeding & User Friendly
  •         ● GELID Applicator
  •         ● Net Content of 5g

 

Description

GC-Pro Thermal Compound (TC-GC-PRO-A)

 

The GC-Pro is made from the purest thermal conducting materials and offers outstanding thermal properties. Thanks to nano scale produced ultra-fine molecular structure the GC-Pro fills spaces more effectively than conventional materials and therefore it provides uniform thermal contact with enhanced heat transfer properties. Created for professionals the GC-Pro thermal compound ensures the best-in-class performance for your CPU, VGA or Chipset heatsink applications. As with the other compounds of GELID Solutions the GC-Pro is non-electrical conductive, non-corrosive, non-curing, non-flammable and non-toxic. The GC-Pro also comes with a GELID applicator which enables an easier application.

 

Net Content: 5g

 

MSRP: USD 6.99 / Euro 6.20

Specification

Specification

Density (g/cm3):2.8
Net Content (g):5
Thermal conductivity (W/mK):7
Viscosity (Centipoise):170000