GP-Ultimate 120×20 Thermal Pad Series
Thickness variants:
Single Pack (1pc included): 0.5 mm (TP-GP04-R-A), 1.0mm (TP-GP04-R-B), 1.5mm (TP-GP04-R-C)
Value Pack (2pcs included): 0.5mm (TP-VP04-R-A), 1.0mm (TP-VP04-R-B), 1.5mm (TP-VP04-R-C), 2mm (TP-VP04-R-D)
The GP-Ultimate 120×20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components. Thanks to its enhanced multilayer matrix, superior material composition, and the ultimate 15W/mK thermal conductivity, the GP-Ultimate 120×20 offers the best performance in class.
The GP-Ultimate 120×20 is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60°C to 220°C. It features seamless application and has the thermal pad dimensions of 120x20mm to best fit enlarged surfaces of RAM Memory modules, GPU and CPU VRM circuits, M.2 Type SSD and other densely packed electronic devices.
Available in 0.5mm, 1mm, 1.5mm & 2mm thickness
MSRP:
Single Pack (1pc included):
0.5mm: USD 3.50 / 3.00 Euro
1mm: USD 4.50 / 3.85 Euro
1.5mm: USD 5.00 / 4.25 Euro
Value Pack (2pcs included):
0.5mm: USD 5.50 / 4.65 Euro
1mm: USD 7.50 / 6.35 Euro
1.5mm: USD 9.50 / 8.00 Euro
2mm: USD 15 / 13 Euro
EAN (Standard):
0.5mm: 4897025782532
1mm: 4897025782549
1.5mm: 4897025782556
EAN (ValuePack 2pcs):
0.5mm: 4897025782631
1mm: 4897025782648
1.5mm: 4897025782655
2mm: 4897025782662
Density (g/cm3): | 3.2 |
Hardness (Shore): | 60-70 OO |
Size (mm): | 120 x 20 |
Thermal Conductivity (W/mK): | 15 |