GELID Solutions Ltd

Unit 704 B, Sunbeam Centre

27 Shing Yip Street, Kwun Tong, Hong Kong

 

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Rev.4 Tranquillocpu_cooler_silent_REV4_TRANQUILLO_3cpu_cooler_silent_REV4_TRANQUILLO_4cpu_cooler_silent_REV4_TRANQUILLO_5cpu_cooler_silent_REV4_TRANQUILLO_6cpu_cooler_silent_REV4_TRANQUILLO_7cpu_cooler_silent_REV4_TRANQUILLO_8cpu_cooler_silent_REV4_TRANQUILLO_9cpu_cooler_silent_REV4_TRANQUILLO_10

REV.4 TRANQUILLO

Features:

  •         ● 4 Power Heatpipes with Direct Touch Technology
  •         ● Unique Heatsink Shape Design
  •         ● Stacked Soldered Heatpipes & Fins
  •         ● PWM IC without Clicking Noise
  •         ● Double Layer Fan Blade Design
  •         ● 5 Years Warranty

 

Description

Rev. 4 Tranquillo (CC-TranQ-04-A)

 

Applications:

Intel Socket 775, 1150, 1151, 1155, 1156, 1366 & 2011*

CPU: All Pentium D/ Pentium 4/ All Celeron D/ All Pentium Dual-Core/ Extreme/ All Core 2 Extreme/ Core 2 Quad/ Core 2 Duo, Core i5, Core i7

AMD Socket AM2, AM2+, AM3, AM3+, FM1, FM2, FM2+:
CPU: All Athlon 64 X2, Athlon 64, All Athlon 64 FX, Opteron, Sempron, Phenom, Phenom II

 

*Mounting clip for socket 2011 needs to be purchased separately.

 

All brands and trademarks are the property of their respective owners.

 

The tower CPU Cooler “Rev. 4 Tranquillo” uses 4 power heat pipes and a special heat pipe constellation to achieve best heat transfer from CPU core to the aluminum fins in its class.

 

Like the original design the Rev. 4 Tranquillo uses 4 power heat pipes and a unique heat pipe constellation but also comes with a number of new technologies implemented to achieve higher cooling performance. The Rev. 4 Tranquillo features the Heatpipe Direct Touch Technology, a direct thermal connection between CPU core and heat pipes. The new heatsink is also improved with the Unique Heatsink Shape Technology, the result of precise software simulations and calculations which makes the air flow resistance of the new heatsink much lower. The Stacked Soldered Heatpipe and Fin Technology provides the best quality of soldered joints between heatpipe to fins and ensures the most efficient heat transfer inside the new heatsink.

 

An improved 120mm fan with the intelligent GELID PWM (Pulse Width Module) control compliments the heatsink. The new Double Layer Blade technology is applied to distribute air flow efficiently at low speed. The redesigned PWM IC eliminates any clicking noise. The intelligent GELID PWM curve operates the fan in speed range from 750 RPM to 1600 RPM, it constantly keeps the fan silent but accelerates speed whenever additional cooling is needed. With the 2 sets of fan mounts, a second fan can be installed to improve the cooler performance even further.

 

Design Concept:

 

1. Enhanced Heatpipe Direct Touch

With the Rev.4 Tranquillo, the CPU surface is directly touching the heatpipes, so heat is transferred much more quickly than of a typical heatsink with heatpipes attached to a copper base-plate. The gapless packing of the precisely machined heatpipes also assures the highest possible quality of thermal connection between CPU and heatpipes, no internal resistance between heatpipes and  100% efficiency of heat transfer.

 

 

2. Stack Fin Soldering

Unlike the other heatsinks, the Rev.4 Tranquillo features a greatly improved technology, Stack Fin Soldering, which assures the most efficient thermal contact between heatpipes and fins thanks to the special solder joints. The solder joints provide the highest thermal conductivity, so heat is transferred efficiently in those parts of the heatsink too. The solder joints also support a stronger mechanical integrity of the heatsink.

 

 

3. Nickel Plating

Poor quality of the fin surface often results in dirty or corroded fins which worsen heat conduction and limit the heatsink thermal performance considerably. The Rev.4 Tranquillo has an improved nickel plating which guaranties ultra-durable quality of the fin surface, and therefore, secures the most efficient heat transfer on the fins.

 

 

So, the Rev.4 Tranquillo is optimized all the way in the heat transfer from a CPU core to the heatsink fins, providing improved cooling, lower noise and higher product quality for your desktops.

 

The multi-award winning high performance GC Pro thermal compound is already included in the package. Mounting clips for multiple AMD™ CPU sockets AM2, AM2+, AM3, AM3+, FM1, FM2 and for Intel™ CPU LGA 775, 1366, 1155, 1156, 1150, 1151 sockets, as well as back plates for AMD and Intel mainboards are all included too.

 

The cooler is RoHS and WEEE conform and carries a 5 year warranty.

 

MSRP: USD 39/ Euro 29

Specification

Specification

Air Flow (CFM / CMH):65.5/111.35 max
Bearing:Hydro Dynamic Bearing
Cable Length (mm):500
Current (A):0.25
DC Voltage (V):12
Fan Dimensions (mm):120 (l) x 120 (w) x 25 (h)
Fan Speed (+/-10%) (RPM):750 – 1600
Heatsink Dimensions (mm):62 (l) x 128 (w) x 154 (h)
Life time MMTF at 40C (h):50’000
Noise Level (dBA):12 – 26.7
Static Pressure (mmAq):2.18
Warrenty (Years):5
Weight (g):580 (Heatsink & Fan)
Installation Manual

Installation Manual

Please have a look at the installation manual.